New Delhi, India: Software Technology Parks of India (STPI) has launched an Open Challenge Programme for electronics and hardware startups as part of the STPI Electropreneur Summit 2026 held at IIIT-Delhi, while also expanding its incubation network across eight northern states and union territories.
The programme is designed to identify and support technology solutions and startups working in Electronics System Design and Manufacturing (ESDM). Alongside its launch, MoUs were exchanged between AIC STPINEXT INITIATIVES, 11 partner institutions serving as Spoke Centres, and investors including Indian Angel Network Services Private Limited and Solara VC.
The Spoke Centre network covers Chandigarh, Delhi, Haryana, Himachal Pradesh, Jammu & Kashmir, Rajasthan, Uttar Pradesh and Uttarakhand. Through these institutions, startups and innovators in the region will be able to access incubation facilities, mentoring, infrastructure and other ecosystem support.
The summit brought together representatives from government, academia and industry to discuss the expansion of India’s ESDM capabilities. K.K. Singh, Joint Secretary at the Ministry of Electronics and Information Technology, said the country’s technology sector is moving towards greater emphasis on electronics manufacturing, semiconductor development and hardware innovation.
Singh highlighted the progress of the first phase of Electropreneur Park, which supported 59 startups, 66 patent filings and more than ₹640 crore in startup valuation. The second phase, EP 2.0, aims to support 500 startups, with a focus on extending participation to Tier-II and Tier-III cities.
STPI Director General Arvind Kumar said India’s electronics production has increased sevenfold over the past decade, rising from less than ₹2 lakh crore to more than ₹13 lakh crore. Electronics exports have increased elevenfold to ₹4.24 lakh crore during the same period.
The first Electropreneur Park phase produced 129 products, 27 trademarks and 66 patent filings, while cumulative revenue reached ₹150 crore. Under EP 2.0, STPI plans to build a broader ESDM innovation ecosystem across North India and support the development of hardware and deep-tech ventures.
The summit also featured a panel discussion on strengthening cooperation between government, academia and industry to accelerate ESDM innovation.
source: This article is based on an official press release issued by the Press Information Bureau (PIB)
Press Release: Press Information Bureau